Co-founder & CEO at Cerebras Systems
First, HBM memory is sold out, which we avoid by using SRAM. Second, TSMC's CoWoS packaging process is fully booked, which we do not use. Third, TSMC's 3-nanometer foundry space is highly congested, while we build our chips using their less constrained 5-nanometer process.
This answer is part of a full interview with Andrew Feldman, Co-founder & CEO at Cerebras Systems.
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